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Impact and Rapid Solidification
Journals
- Tran, A. T. T., Hyland, M. M., Shinoda, K., & Sampath, S. Influence of substrate surface conditions on the deposition and spreading of molten droplets. (2011), Thin Solid Films, 519(8), 2445-2456.
- Tran, A. T. T., Hyland, M. M., Shinoda, K., & Sampath, S. Inhibition of molten droplet deposition by substrate surface hydroxides (2011), Surface and Coatings Technology, 206(6), 1283-1292.
- R.Molz, A.Valarezo and S.Sampath, “Comparison of Coating Stresses Produced by High Velocity Liquid/Gas Fuel and Triplex Pro 200 Plasma Processes Using In-Situ Coating Stress Measurement, ITSC 2008, Maastricht, Netherlands, CD Proceedings.
- L.Li, B.Kharas, H.Zhang and S.Sampath, “Suppression of crystallization during high velocity impact quenching of alumina: observations and characterization”, Materials Science and Engineering, A 456 (2007) 35-42.
- B.Kharas, G.Wei, S.Sampath and H.Zhang, “Morphology and microstructure of thermal plasma sprayed silicon splats and coatings”, Surface and Coatings Technology, 201 (2006) 1454-1463.
- L. Li, G. Wei, A. Vaidya, H. Zhang and S. Sampath, “Substrate Melting during Thermal Spray Splat Quenching”, Thin Solid Films, 468 (2004), pp. 113-119.
- L. Li, G. Wei, A. Vaidya, H. Zhang and S. Sampath, “Substrate Melting during Thermal Spray Splat Quenching”, Thin Solid Films, 468 (2004), pp. 113-119.
- H. Zhang, X. Y. Wang, L. L. Zheng and S. Sampath, “Numerical simulation of nucleation, solidification, and microstructure formation in thermal spraying”, International Journal of Heat and Mass Transfer, 47 (2004), pp. 2191-2203.
- G. X. Wang, R. Goswami, S. Sampath and V. Prasad, “Understanding the heat transfer and solidification of plasma-sprayed yttria-partially stabilized zirconia coatings”, Materials and Manufacturing Processes, 19 (2004), pp. 259-272.
- H. Zhang, G. Wei, L. Zheng, L. Li, X. Y. Wang and A. Vaidya, “Numerical and experimental studies of substrate melting and resolidification during thermal spraying”, Journal of Materials Science & Technology, 19 (2003), pp. 137-140.
- X. Y. Wang, H. Zhang, L. L. Zheng and S. Sampath, “An integrated model for interaction between melt flow and non-equilibrium solidification in thermal spraying”, International Journal of Heat and Mass Transfer, 45 (2002), pp. 2289-2301.
- G. X. Wang, V. Prasad and S. Sampath, “Rapid solidification in thermal spray deposition: Microstructure and modeling”, Sadhana-Academy Proceedings in Engineering Sciences, 26 (2001), pp. 35-57.
- S. Sampath and X. Jiang, “Splat formation and microstructure development during plasma spraying: deposition temperature effects”, Mater. Sci. & Eng. A, 304-306 (2001), pp. 144-150.
- H. Zhang, X. Y. Wang, L. L. Zheng and X. Y. Jiang, “Studies of splat morphology and rapid solidification during thermal spraying”, International Journal of Heat and Mass Transfer, 44 (2001), pp. 4579-4592.
- Y. P. Wan, H. Zhang, X. Y. Jiang, S. Sampath and V. Prasad, “Role of solidification, substrate temperature and Reynolds number on droplet spreading in thermal spray deposition: Measurements and modeling”, Journal of Heat Transfer-Transactions of the Asme, 123 (2001), pp. 382-389
- G. X. Wang and V. Prasad, “Microscale heat and mass transfer and non-equilibrium phase change in rapid solidification”, Mater. Sci. & Eng. A, 292 (2000), pp. 142-148.
- G. X. Wang, V. Prasad and S. Sampath, “An integrated model for dendritic and planar interface growth and morphological transition in rapid solidification”, Metallurgical and Materials Transactions A, 31 (2000), pp. 735-746.
- C.Yao, G.-X.Wang, and B.T.F.Chung, “A Non-Equilibrium Planar Interface Solidification Model for Semitransparent Radiating Materials,” AIAA J. Thermophysics Heat Transfer, 14 (2000), pp. 297-304.
- T.Chraska and A.H.King, “Growth of Columnar Grains During Zirconia-Yttria Splat Solidification”, J Materials Science Letters, 18 (1999), pp. 1517.
- H. Zhang, “Theoretical Analysis of Spreading and Solidification of A molten Droplet During Thermal Spray Deposition”, Intl. J. Heat Mass Transfer, 42 (1999), pp. 2499.
- H.Zhang,. L.L.Zheng, V.Prasad, and T.Y.Hou, “A Curvilinear Level Set Formulation for Highly Deformable Free Surfaces with Application to Solidification”, Num. Heat Transfer, 34 (1998), pp. 1.
- G.-X. Wang, S. Sampath, V. Prasad, and H. Herman, “On the Stability of Rapid Planar Solidification During Melt-Substrate Quenching”, Mater. Sci. & Eng. A226-228 (1997), pp. 1035.
- G. X. Wang and V. Prasad, , “Non Equilibrium Phenomena in Rapid Solidification: Theoretical Treatment for Process Modeling,” Microscale Thermophysical Eng., 1(1997), pp. 143.
- G. X. Wang, V. Prasad, and E.F. Matthys, “An Interface Tracking Numerical Method for Rapid Solidification of Binary Alloys with Application to Microsegregation,” Mater. Sci. & Eng. A, Vol.A225(1997), pp. 47.
Proceedings
- L. Li, X. Y. Wang, A. Vaidya, G. Wei, H. Zhang and S. Sampath, “Substrate Melting During Thermal Spray Splat Quenching: Case Study for Molybdenum Droplets on Various Substrates”, in C. Moreau and B. R. Marple, eds., Thermal Spray 2003 : Advancing the Science and Applying the Technology, ASM Int., Orlando, Fl, USA, 2003, p1041-1046
- G. Wei, H. Zhang, L. Li and X. Y. Wang, “Numerical and Experimental Studies of Substrate Melting during Thermal Spraying”, HT2003: ASME Summer Heat Transfer Conference, HT2003-47154, Las Vegas, Nevada, 2003, Electronic Proceedings
- H. Zhang, X. Y. Wang and S. Sampath, “Analysis of Undercooling Nucleation, Rapid Solidification, and Microstructure Formation in Thermal Spraying”, International Mechanical Engineering Congress and Exposition 2002-32907, ASME International, New Orleans, Louisiana, 2002, p1-13
- X. Y. Wang, H. Zhang, L. L. Zheng, and S. Sampath, “A Micro/Macro Integrated Model for Melt Flow and Non-Equilibrium Solidification for Thermal Spraying”, International Mechanical Engineering Congress and Exposition 2001-24367, ASME International, New York, New York, 2001, p1.
- Y. P. Wan, H. Zhang, X. Y. Jiang, S. Sampath and V. Prasad, “Role of Solidification, Substrate Temperature and Reynolds Number on Droplet Spreading in Thermal Spray Deposition”, 33rd National Heat Transfer Conference, Journal of Heat Transfer-Transactions of the ASME, Albuquerque, NHTC99-121, NM, 2000, Electronic Proc.
- G.-X.Wang, X.Y.Jiang, and S.Sampath, Grain Structure Development in Plasma Sprayed Coatings: Experiment and Modeling, in Surface Eng. in Materials Science I, TMS, Nashville, Tennessee, 2000, p197-209.
- G. X. Wang, V. Prasad, and S. Sampath, “Rapid Solidification in Thermal Spray Deposition: Microstructure and Modeling”, Intl. Workshop on Solidification Processing, India, 2000.
- G.-X. Wang, R. Goswami, S. Sampath and V. Prasad, “Heat Transfer and Solidification Analysis of Splat Formation in Plasma-Sprayed Zirconia-Yttria Thermal Barrier Coatings”, 4th ISHMT/ASME Heat Transfer Conference, Pune, India, 2000, p.1135.
- G.-X. Wang, V. Prasad and S. Sampath, “Rapid Solidification in Thermal Spray Deposition: Microstructure and Modeling”, International Workshop on Solidification Processing, India, 2000, Vol. 26(1-2), p.35.
- X. Y. Jiang, Y. Wan, X. Y. Wang, H. Zhang, R. Goswami, H. Herman and S. Sampath, “Investigation of Splat/Substrate Contact during Molybdenum Thermal Spraying”, in C. C. Berndt, ed., Thermal Spray: Surface Engineering via Applied Research (ITSC 2000), ASM International, Materials Park, OH, USA, Montreal, Quebec, Canada, 2000, p729
- H. Zhang, “Mechanism and Modeling of Micro-droplet Impact, Fragmentation and Solidification”, IMECE'2000, Orlando, Fl, USA, 2000, HTD-Vol. 366-3, p.367-379.
- H. Zhang, G.-X. Wang, L. L. Zheng, Y. P. Wan and X. Y. Jiang, “Experimental/Numerical Studies of Substrate Melting and Splat Morphology During Spraying”, National Heat Transfer Conference 2000-12184, 2000, p.1-13.
- Y.P.Wan,. H.Zhang, X.Y.Jiang, S.Sampath and V.Prasad, “Role of Solidification, Substrate Temperature and Reynolds Number on Droplet Spreading in Thermal Spray Deposition”, Proc. of 33rd Natl. Heat Transfer Conf., NHTC99-121, Albuquerque, New Mexico.
- T.Chraska and A.H. King, “Interfaces in Rapidly Solidified Zirconia-Yttria”, Intl. Conference on Interfaces and Interphase Boundaries, July 1998, Prague, C.R. Mater. Sci. Forum 294-296 (1999)779.
- G.X.Wang, V.Prasad, S.Sampath and H.Herman, “Modeling of Rapid Solidification During Splat Quenching”, Solidification (1998) TMS, p485.
- G. X.Wang, S.Sampath, V.Prasad, and H.Herman, “Mathematical Model for Microsegregation in Rapidly Solidified Alloys,” Modeling Casting, Welding Advanced Solidification Processes - VIII, TMS, 1998, p219.
- R.A.Vardelle, G. X.Wang, S.Sampath, “Analysis of Nucleation, Phase Selection and Rapid Solidification of an Alumina Splat,” in Thermal Spray: A United Forum for Scientific and Technological Advances, C.C. Berndt (Ed.), ASM Int., Materials Park, Ohio, 1997, p635.
- H. Zhang, V. Prasad, and S. Sampath, “Dynamic Simulations of Multiple-Splat Spreading and Solidification”, Thermal Spray: A United Forum for Scientific and Technological Advances, Published by ASM Intl., Materials Park, Ohio,Ed. C.C.Berndt, (1997), p645.