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Impact and Rapid Solidification

Journals

  1. Tran, A. T. T., Hyland, M. M., Shinoda, K., & Sampath, S. Influence of substrate surface conditions on the deposition and spreading of molten droplets. (2011), Thin Solid Films, 519(8), 2445-2456.
  2. Tran, A. T. T., Hyland, M. M., Shinoda, K., & Sampath, S. Inhibition of molten droplet deposition by substrate surface hydroxides (2011), Surface and Coatings Technology, 206(6), 1283-1292.
  3. R.Molz, A.Valarezo and S.Sampath, “Comparison of Coating Stresses Produced by High Velocity Liquid/Gas Fuel and Triplex Pro 200 Plasma Processes Using In-Situ Coating Stress Measurement, ITSC 2008, Maastricht, Netherlands, CD Proceedings.
  4. L.Li, B.Kharas, H.Zhang and S.Sampath, “Suppression of crystallization during high velocity impact quenching of alumina: observations and characterization”, Materials Science and Engineering, A 456 (2007) 35-42.
  5. B.Kharas, G.Wei, S.Sampath and H.Zhang, “Morphology and microstructure of thermal plasma sprayed silicon splats and coatings”, Surface and Coatings Technology, 201 (2006) 1454-1463.
  6. L. Li, G. Wei, A. Vaidya, H. Zhang and S. Sampath, “Substrate Melting during Thermal Spray Splat Quenching”, Thin Solid Films, 468 (2004), pp. 113-119.
  7. L. Li, G. Wei, A. Vaidya, H. Zhang and S. Sampath, “Substrate Melting during Thermal Spray Splat Quenching”, Thin Solid Films, 468 (2004), pp. 113-119.
  8. H. Zhang, X. Y. Wang, L. L. Zheng and S. Sampath, “Numerical simulation of nucleation, solidification, and microstructure formation in thermal spraying”, International Journal of Heat and Mass Transfer, 47 (2004), pp. 2191-2203.
  9. G. X. Wang, R. Goswami, S. Sampath and V. Prasad, “Understanding the heat transfer and solidification of plasma-sprayed yttria-partially stabilized zirconia coatings”, Materials and Manufacturing Processes, 19 (2004), pp. 259-272.
  10. H. Zhang, G. Wei, L. Zheng, L. Li, X. Y. Wang and A. Vaidya, “Numerical and experimental studies of substrate melting and resolidification during thermal spraying”, Journal of Materials Science & Technology, 19 (2003), pp. 137-140.
  11. X. Y. Wang, H. Zhang, L. L. Zheng and S. Sampath, “An integrated model for interaction between melt flow and non-equilibrium solidification in thermal spraying”, International Journal of Heat and Mass Transfer, 45 (2002), pp. 2289-2301.
  12. G. X. Wang, V. Prasad and S. Sampath, “Rapid solidification in thermal spray deposition: Microstructure and modeling”, Sadhana-Academy Proceedings in Engineering Sciences, 26 (2001), pp. 35-57.
  13. S. Sampath and X. Jiang, “Splat formation and microstructure development during plasma spraying: deposition temperature effects”, Mater. Sci. & Eng. A, 304-306 (2001), pp. 144-150.
  14. H. Zhang, X. Y. Wang, L. L. Zheng and X. Y. Jiang, “Studies of splat morphology and rapid solidification during thermal spraying”, International Journal of Heat and Mass Transfer, 44 (2001), pp. 4579-4592.
  15. Y. P. Wan, H. Zhang, X. Y. Jiang, S. Sampath and V. Prasad, “Role of solidification, substrate temperature and Reynolds number on droplet spreading in thermal spray deposition: Measurements and modeling”, Journal of Heat Transfer-Transactions of the Asme, 123 (2001), pp. 382-389
  16. G. X. Wang and V. Prasad, “Microscale heat and mass transfer and non-equilibrium phase change in rapid solidification”, Mater. Sci. & Eng. A, 292 (2000), pp. 142-148.
  17. G. X. Wang, V. Prasad and S. Sampath, “An integrated model for dendritic and planar interface growth and morphological transition in rapid solidification”, Metallurgical and Materials Transactions A, 31 (2000), pp. 735-746.
  18. C.Yao, G.-X.Wang, and B.T.F.Chung, “A Non-Equilibrium Planar Interface Solidification Model for Semitransparent Radiating Materials,” AIAA J. Thermophysics Heat Transfer, 14 (2000), pp. 297-304.
  19. T.Chraska and A.H.King, “Growth of Columnar Grains During Zirconia-Yttria Splat Solidification”, J Materials Science Letters, 18 (1999), pp. 1517.
  20. H. Zhang, “Theoretical Analysis of Spreading and Solidification of A molten Droplet During Thermal Spray Deposition”, Intl. J. Heat Mass Transfer, 42 (1999), pp. 2499.
  21. H.Zhang,. L.L.Zheng, V.Prasad, and T.Y.Hou, “A Curvilinear Level Set Formulation for Highly Deformable Free Surfaces with Application to Solidification”, Num. Heat Transfer, 34 (1998), pp. 1.
  22. G.-X. Wang, S. Sampath, V. Prasad, and H. Herman, “On the Stability of Rapid Planar Solidification During Melt-Substrate Quenching”, Mater. Sci. & Eng. A226-228 (1997), pp. 1035.
  23. G. X. Wang and V. Prasad, , “Non Equilibrium Phenomena in Rapid Solidification: Theoretical Treatment for Process Modeling,” Microscale Thermophysical Eng., 1(1997), pp. 143.
  24. G. X. Wang, V. Prasad, and E.F. Matthys, “An Interface Tracking Numerical Method for Rapid Solidification of Binary Alloys with Application to Microsegregation,” Mater. Sci. & Eng. A, Vol.A225(1997), pp. 47.

Proceedings

 

 

  1. L. Li, X. Y. Wang, A. Vaidya, G. Wei, H. Zhang and S. Sampath, “Substrate Melting During Thermal Spray Splat Quenching: Case Study for Molybdenum Droplets on Various Substrates”, in C. Moreau and B. R. Marple, eds., Thermal Spray 2003 : Advancing the Science and Applying the Technology, ASM Int., Orlando, Fl, USA, 2003, p1041-1046
  2. G. Wei, H. Zhang, L. Li and X. Y. Wang, “Numerical and Experimental Studies of Substrate Melting during Thermal Spraying”, HT2003: ASME Summer Heat Transfer Conference, HT2003-47154, Las Vegas, Nevada, 2003, Electronic Proceedings
  3. H. Zhang, X. Y. Wang and S. Sampath, “Analysis of Undercooling Nucleation, Rapid Solidification, and Microstructure Formation in Thermal Spraying”, International Mechanical Engineering Congress and Exposition 2002-32907, ASME International, New Orleans, Louisiana, 2002, p1-13
  4. X. Y. Wang, H. Zhang, L. L. Zheng, and S. Sampath, “A Micro/Macro Integrated Model for Melt Flow and Non-Equilibrium Solidification for Thermal Spraying”, International Mechanical Engineering Congress and Exposition 2001-24367, ASME International, New York, New York, 2001, p1.
  5. Y. P. Wan, H. Zhang, X. Y. Jiang, S. Sampath and V. Prasad, “Role of Solidification, Substrate Temperature and Reynolds Number on Droplet Spreading in Thermal Spray Deposition”, 33rd National Heat Transfer Conference, Journal of Heat Transfer-Transactions of the ASME, Albuquerque, NHTC99-121, NM, 2000, Electronic Proc.
  6. G.-X.Wang, X.Y.Jiang, and S.Sampath, Grain Structure Development in Plasma Sprayed Coatings: Experiment and Modeling, in Surface Eng. in Materials Science I, TMS, Nashville, Tennessee, 2000, p197-209.
  7. G. X. Wang, V. Prasad, and S. Sampath, “Rapid Solidification in Thermal Spray Deposition: Microstructure and Modeling”, Intl. Workshop on Solidification Processing, India, 2000.
  8. G.-X. Wang, R. Goswami, S. Sampath and V. Prasad, “Heat Transfer and Solidification Analysis of Splat Formation in Plasma-Sprayed Zirconia-Yttria Thermal Barrier Coatings”, 4th ISHMT/ASME Heat Transfer Conference, Pune, India, 2000, p.1135.
  9. G.-X. Wang, V. Prasad and S. Sampath, “Rapid Solidification in Thermal Spray Deposition: Microstructure and Modeling”, International Workshop on Solidification Processing, India, 2000, Vol. 26(1-2), p.35.
  10. X. Y. Jiang, Y. Wan, X. Y. Wang, H. Zhang, R. Goswami, H. Herman and S. Sampath, “Investigation of Splat/Substrate Contact during Molybdenum Thermal Spraying”, in C. C. Berndt, ed., Thermal Spray: Surface Engineering via Applied Research (ITSC 2000), ASM International, Materials Park, OH, USA, Montreal, Quebec, Canada, 2000, p729
  11. H. Zhang, “Mechanism and Modeling of Micro-droplet Impact, Fragmentation and Solidification”, IMECE'2000, Orlando, Fl, USA, 2000, HTD-Vol. 366-3, p.367-379.
  12. H. Zhang, G.-X. Wang, L. L. Zheng, Y. P. Wan and X. Y. Jiang, “Experimental/Numerical Studies of Substrate Melting and Splat Morphology During Spraying”, National Heat Transfer Conference 2000-12184, 2000, p.1-13.
  13. Y.P.Wan,. H.Zhang, X.Y.Jiang, S.Sampath and V.Prasad, “Role of Solidification, Substrate Temperature and Reynolds Number on Droplet Spreading in Thermal Spray Deposition”, Proc. of 33rd Natl. Heat Transfer Conf., NHTC99-121, Albuquerque, New Mexico.
  14. T.Chraska and A.H. King, “Interfaces in Rapidly Solidified Zirconia-Yttria”, Intl. Conference on Interfaces and Interphase Boundaries, July 1998, Prague, C.R. Mater. Sci. Forum 294-296 (1999)779.
  15. G.X.Wang, V.Prasad, S.Sampath and H.Herman, “Modeling of Rapid Solidification During Splat Quenching”, Solidification (1998) TMS, p485.
  16. G. X.Wang, S.Sampath, V.Prasad, and H.Herman, “Mathematical Model for Microsegregation in Rapidly Solidified Alloys,” Modeling Casting, Welding Advanced Solidification Processes - VIII, TMS, 1998, p219.
  17. R.A.Vardelle, G. X.Wang, S.Sampath, “Analysis of Nucleation, Phase Selection and Rapid Solidification of an Alumina Splat,” in Thermal Spray: A United Forum for Scientific and Technological Advances, C.C. Berndt (Ed.), ASM Int., Materials Park, Ohio, 1997, p635.
  18. H. Zhang, V. Prasad, and S. Sampath, “Dynamic Simulations of Multiple-Splat Spreading and Solidification”, Thermal Spray: A United Forum for Scientific and Technological Advances, Published by ASM Intl., Materials Park, Ohio,Ed. C.C.Berndt, (1997), p645.
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